Productions
Foundry Services
Unlock a world of possibilities with our vast foundry partnerships. Gain access to industry leaders like Sharp, TSMC, UMC, and more, spanning a spectrum of process options from mature 0.35µm to cutting-edge 5nm FinFET and beyond. We even offer access to specialized GaAs wafer foundry services through our trusted partner WIN.
Go beyond mere access – choose a true partner. Socle's expertise extends beyond foundry relationships. We provide comprehensive turnkey solutions, including tapeout, wafer manufacturing, WAT/CP analysis, corner lot planning, and yield improvement. Let us navigate the complexities of your project, from chip design to final production.
Partner foundries: Sharp, TSMC, UMC, Global Foundries, VIS, SMIC, Win Foundry, Tower semi and Siltella.
Assembly
Unwavering quality is our hallmark. We continuously refine our testing programs and design rules to consistently deliver the optimal package for your product. Whether you seek established solutions like BGA and QFP for their reliability, flip chip and SiP for optimal value, or cutting-edge CoWoS® our expertise guides you every step of the way.
Features: CoWoS® / BGA / QFP / QFN / Flip chip / WLCSP / SiP/ AiP / AiM / 3D Fabric / more ...
Testing
Erom simple to sophisticated, we test it all. Our turnkey engineering team commands the full spectrum of testing capabilities, covering DC, digital, analog, and RF across the entire product range. Whether you're developing a basic low-end device or a cutting-edge high-end marvel, we possess the expertise and equipment to deliver unmatched coverage.
Experience you can trust. Our team boasts a wealth of knowledge and a proven track record in customizing testing programs for clients around the globe. We utilize industry-leading test platforms like V93K, J750EX, and Diamondx to meticulously craft solutions that cater to every project's unique needs.
Test Tooling design
Test engineering experienced on High-speed digital(SerDes), Mixed-signal, RF devices & Power device.
A digital test pattern with test coverage up to 1.6Gbps.(PS1600)
Direct docking probe card & Fine pitch < 50um for Wafer Sorting.
Merge system circuit to load board for Final Testing.
Module system testing automation with Module Testing.
Scalable configurations for RF applications.